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WD the world’s first company to develop its new 96 layer 3D NAND technology

By John Law - on 29 Jun 2017, 3:49pm

WD the world’s first company to develop its new 96 layer 3D NAND technology

Image source: WD.

Western Digital Corp. (WD), one of the world’s most renowned names in storage technology and solutions, recently announced its success in developing its next-generation 3D NAND technology.

Known as BiCS4, this new storage format consists of 96 layers of storage cells stacked vertically. In theory, this new format will allow WD to create storage solutions with faster sequential read and write speeds, and larger storage capacities.

“Our successful development of the industry’s first 96-layer 3D NAND technology demonstrates Western Digital’s continued leadership in NAND flash and solid execution to our technology roadmap,” Dr. Siva Sivaram, Executive Vice President of Memory Technology, Western Digital said. “BiCS4 will be available in 3-bits-per-cell and 4-bits-per-cell architectures, and it contains technology and manufacturing innovations to provide the highest 3D NAND storage capacity, performance and reliability at an attractive cost for our customers. Western Digital’s 3D NAND portfolio is designed to address the full range of end markets spanning consumer, mobile, computing and data center.”

BiCS4 was jointly developed by WD and its manufacturing partner, the Toshiba Corporation. WD is hoping to deployed the new medium in a 256 Gigabit chip, with plans to create another chip with the ability to store a terabit on to a single chip.

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