News
News Categories

MWC Shanghai: Qualcomm's Snapdragon 450 chipset brings high-end features to entry-level smartphones

By John Law & James Lu - on 29 Jun 2017, 9:55am

MWC Shanghai: Qualcomm's Snapdragon 450 chipset brings high-end features to entry-level smartphones

Qualcomm announced its new Snapdragon 450 Mobile Platform at MWC Shanghai today. The 450 is the first entry-level mobile processor to be based on a 14nm FinFET process, with Qualcomm promising significant improvements in battery life, graphics and compute performance, imaging and LTE connectivity over its predecessor, the Snapdragon 435 Mobile Platform.

Qualcomm has focused on four main areas of improvement for the Snapdragon 450:

CPU and GPU: The 450 utilizes a higher-performing octa-core ARM Cortex A53 CPU that results in a 25 percent increase in compute performance compared to its predecessor. Additionally, the integrated Qualcomm Adreno 506 GPU delivers a 25 percent increase in graphics performance over the Snapdragon 435. 

Battery life: Power management improvements result in up to four additional hours of usage time compared to the Snapdragon 435, as well as up to a 30 percent reduction in power when gaming. The Snapdragon 450 also comes with Qualcomm Quick Charge 3.0 support, which can charge a smartphone from zero to 80 percent in about 35 minutes. 

Camera and multimedia: The Snapdragon 450 is the first in the 400-tier to support realtime Bokeh (Live Bokeh) effects. It is also designed to improve on previous generations by including support for enhanced dual camera at 13MP + 13MP, or single camera support up to 21MP; hybrid autofocus; and 1080p video capture and playback at up to 60fps, enabling slow motion capture. The Snapdragon 450 also includes support for Full HD displays, as well as the Qualcomm Hexagon DSP, which enables multimedia, camera and sensor processing at greater performance and lower power than the previous generation.

Connectivity and USB: The Snapdragon 450 uses Qualcomm's Snapdragon X9 LTE modem, which utilizes 2x20MHz carrier aggregation in both downlink and uplink for peak speeds of 300 Mbps and 150 Mbps respectively, support for a large number of mobile networks with Snapdragon All Mode, and 802.11ac with MU-MIMO support. The Snapdragon 450 is also the first entry-level processor to support USB 3.0.

“We’ve made many recent changes to the Snapdragon Mobile Platforms as part of our vision to deliver the most advanced mobile functionality at the best possible value, and the Snapdragon 450 Mobile Platform is another realization of that vision,” said Kedar Kondap, vice president, product management, Qualcomm Technologies, Inc. “With the Snapdragon 450, users are going to see a dramatically improved level of performance, connectivity, battery life and imaging performance.”

Snapdragon 450 devices are expected to be available in consumer devices by the end of the year.