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Intel announces its first Lakefield processors for ultrathin and foldable notebooks

By Kenny Yeo - on 11 Jun 2020, 10:40am

Intel announces its first Lakefield processors for ultrathin and foldable notebooks

(Image source: Intel)

Intel has just lifted the wraps off its first Lakefield processors.

It's a new family of processors designed for low-power and ultrathin applications.

To do that, the two Lakefield processors announced today will use a hybrid configuration consisting of a single big "Sunny Cove" core and four small "Tremont" cores.

The more powerful 10nm "Sunny Cove" core will handle heavier workloads while less demanding ones will be taken care of by the less powerful but more efficient (also 10nm) "Tremont" cores.

Intel is also calling these processors "Intel Core processors with hybrid technology".

(Image source: Intel)

Another notable feature of these chips is that they will be the first to employ Intel's Foveros 3D chip stacking technology.

By stacking memory, CPU, and graphics dies on top of each other, it allows Intel to offer these chips in smaller packages, which in turns allows manufacturers to build devices in smaller and more interesting form factors – like foldable PCs.

As for graphics, these chips will feature an Intel Gen11 GPU with 64 execution units – the same configuration found in many of the company's Ice Lake processors. However, these integrated GPUs will run at considerably lower clock speeds.

Two SKUs are being announced today, the Core i5-16G7 and Core i3-13G4. Both are five core parts with a rated TDP of just 7W. Here's a quick rundown of their specifications:

Model Core i3-L13G4 Core i5-L16G7
Cores / Threads 5/5 5/5
Base clock speed 0.8GHz 1.4GHz
Max turbo clock speed (single) 2.8GHz 3GHz
Max turbo clock speed (all) 1.3GHz 1.8GHz
Intel Smart Cache 4MB 4MB
Graphics Gen 11 (64 EUs) Gen 11 (64 EUs)
Max graphics clock speed 500MHz 500MHz
Memory support LPDDR4X-4267 LPDDR4X-4267
TDP 7W 7W

Ultimately, these processors are Intel's answer to the increasing number of ARM processors being used in smaller, ultraportable devices like the Samsung Galaxy Book S and Microsoft Surface Pro X.

Lenovo ThinkPad X1 Fold (Image source: Lenovo)

To end, Intel also announced that its Lakefield processors will be appearing in a couple of devices that are coming soon. The first is the Lenovo ThinkPad X1 Fold, a foldable PC that was announced earlier this year. The second is an Intel version of the SamsungGalaxy Book S ultraportable notebook. And finally, we have the Microsoft Surface Neo.