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Intel reportedly pushing forward timeline for upcoming high-end desktop CPUs
By John Law - on 20 Apr 2017, 6:39pm

Intel reportedly pushing forward timeline for upcoming high-end desktop CPUs

Image source: WCCFTech.

Intel might be feeling the proverbial pinch in its side with the launch of AMD’s new Ryzen CPUs, so much so that the semi-conductor maker has decided to bring forward the production timeline for three of its upcoming CPU lines: Skylake-X, Kaby Lake-X, Coffee Lake, and Basin Falls.

The news was confirmed by both tech sites, Digitimes and WCCFTech, and this bit of new comes right after Intel had announced the cancellation of its annual Intel Developer Forum event. Coincidentally, this piece of news also came after insider information had said that AMD was also planning on releasing a new 16-core, 32-thread Ryzen CPU and its accompanying X399 platform during Q3 of 2017 this year.

If the source is to believed, then there is a very good chance that Intel will be releasing its new Coffee Lake CPU and the Z370 chipset sometime in August, along with several other CPUs along the line.

With regards to Intel’s Extreme HEDT CPUs, Digitmes reported that Intel might release as many as four SKUs for its X299 platform. All CPUs, including iterations of Skylake-X and Kaby Lake-X, will naturally be based on the 14nm lithography, which translates to better power and thermal efficiency. Specifically, Skylake-X will feature a rated TDP of 140W, while Kaby Lake-X will feature a TDP of 112W.

News about Basin Falls, the follow-up to Skylake-X and Kaby Lake-X, is also mentioned. But besides the information that Basin Falls will use a brand new platform known as Socket R4, nothing else about the CPU has been mentioned.

A chart of Intel's HEDT CPUs, old and new. <br> Image source: WCCFTech.

 Until Intel themselves officially make a statement, we do advise our readers to take this news with a pinch of salt. If it does stand true, however, then it’s very likely that the company will be making something of an announcement during COMPUTEX this year at Taiwan.

Source: Digitimes via WCCFTech, TechSpot.