Cooler Master Expands Heatsink Lineup with Vapor Chamber Integration
After introducing the first vertical vapor chamber heatsink earlier this year, Cooler Master has announced the broader adoption of Vapor Chamber Technology in its retail heatsinks.
Cooler Master is expanding the TPC series and will equip selected models of the V series with the horizontal vapor chambers. Spreading heat eight times faster than solid copper evenly across the base of a heatsink, the horizontal vapor chambers enables speedier and more efficient transfer of heat from the CPU to the heatpipes and fins, resulting in lower temperatures with less noisy fans.
The V4 GTS, the first Cooler Master heatsink with a horizontal vapor chamber, will be released in Q3 2012.
Source: Cooler Master